Polymer-free mechanically robust carbon fiber foams | 5124
Journal of Aeronautics & Aerospace Engineering

Journal of Aeronautics & Aerospace Engineering
Open Access

ISSN: 2168-9792


Polymer-free mechanically robust carbon fiber foams

3rd International Conference and Exhibition on Mechanical & Aerospace Engineering

October 05-07, 2015 San Francisco, USA

Claudia C Luhrs

Naval Postgraduate School, USA

Posters-Accepted Abstracts: J Aeronaut Aerospace Eng

Abstract :

Polymer-free mechanically robust mats of intertwined nanofibers of pure carbon were grown using the Constrained Formation of Fibrous Nanostructures process. Characterization of the microstructure, mechanical and electrical properties of the low density foam-like samples confirmed the uniqueness of the material. It is formed entirely of independent fibers of diverse diameters that interlock forming a tridimensional body that when subject to cyclic compressive loads shows a linear correlation between strain and electrical resistivity. Moreover, the fibrous product regains its shape after loads are removed, presenting a viscoelastic behavior, is light weight, thermally stable up to 550 �?°C, hydrophobic and electrically conductive. The potential of the foams as energy absorbers was tested in the bare material and on CFF hybrids. For the later, IFWS2 nano particulates, well known shock absorbers, and non-Newtonian fluids were embedded into the fiber microstructure. Earlier reported strategies to develop tridimensional structures using carbon nanotubes or carbon fibers are quite complex, difficult to reproduce or expensive, and most of them involve a polymeric component. Control over the nano-fiber or nano-tube based 3D macroscopic object geometry, density, and means to create an interface with other components has turned to be a titanic effort. Here, we present a process by which the Carbon Fiber Foam (CFF) can be grown into different shapes and sizes at moderate temperatures, opening a wide window of possible applications. Challenges found when scaling up the fabrication process and routes to address them will be presented.

Biography :