Rochester Institute of Technology
New York, USA
Master of Engineering in Microelectronics from Rochester Institute of Technology, New York
Driven, highly analytical and results oriented Engineer with 8 years of experience in quality, reliability, research & development focusing on semiconductor devices, electronic materials and test equipment.
Area of research is semiconductors primarily focused on novel materials, test devices and equipment path finding for end applications in MEMS, device packaging, sensors, wearable technology, memory and energy storage devices. I have in depth expertise in design and development of advanced semiconductor equipment and processes such as Lithography, Chemical Mechanical Planarization, Ion Implantation, Diffusion, Thin Film Deposition and Etch. I also have R&D experience in using advanced characterization and failure analysis tools such as Scanning Electron Microscope (SEM), Fourier Transform Infrared Spectroscopy (FTIR), Confocal Scanning Acoustic Microscopy (C-SAM) and X-ray diffraction (XRD) to check for complicated defects in semiconductor devices.